Flip chip bonding tool

Details Flip chip bonding tool Flip chip bonding tool

2004-10-13

2008-12-02

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

C156S580100, C156S580200

Reexamination Certificate

active

07458495

ABSTRACT:
A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.

REFERENCES:
patent: 5245243 (1993-09-01), Ohnishi et al.
patent: 5427301 (1995-06-01), Pham et al.
patent: 2005/0079091 (2005-04-01), Lundberg et al.
patent: 46-26212 (1971-07-01), None
patent: 4-152644 (1992-05-01), None
patent: 08085839 (1996-02-01), None
patent: WO 00/77265 (2000-12-01), None
Toshihiro, Translation to JP 08-085839, Sep. 1994, 8 pages.

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