Flip-chip bonding structure using multi chip...

Details Flip-chip bonding structure using multi chip... Flip-chip bonding structure using multi chip...

2008-05-20

2008-05-20

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S774000, C257S778000, C257SE23021

Reexamination Certificate

active

11302635

ABSTRACT:
Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined position of the silicon substrate, wherein a material of the Si-bump is the same as the silicon substrate, a dielectric layer disposed on the silicon substrate and a transmission line formed on the Si-bump to connect to a circuit formed on the dielectric layer.

REFERENCES:
patent: 5346857 (1994-09-01), Scharr et al.
patent: 6087719 (2000-07-01), Tsunashima
patent: 6137125 (2000-10-01), Costas et al.
patent: 6562653 (2003-05-01), Ma et al.
patent: 6881974 (2005-04-01), Wood et al.
patent: 6936918 (2005-08-01), Harney et al.
patent: 7045886 (2006-05-01), Sawada
patent: 2007/0001266 (2007-01-01), Arana et al.

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