Flip chip bonding structure

Details Flip chip bonding structure Flip chip bonding structure

2005-09-01

2009-10-06

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S772000, C257S778000, C257S780000, C257S786000, C257SE23021, C438S108000, C228S180220

Reexamination Certificate

active

07598613

ABSTRACT:
A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface formed with a metal bump projected therefrom and which is bonded to the connection surface of the solid device as directing its functional surface to the connection surface and maintaining a predetermined distance between the functional surface and the connection surface; and a connecting member containing a low melting point metal having a lower solidus temperature than that of the connection electrode and the bump, and interconnecting the connection electrode and the bump. A sum of a height of the connection electrode and a height of the bump is not less than a half of the predetermined distance.

REFERENCES:
patent: 6229220 (2001-05-01), Saitoh et al.
patent: 6734556 (2004-05-01), Shibata
patent: 7382049 (2008-06-01), Ho et al.
patent: 2002/0149117 (2002-10-01), Shibata
patent: 2004/0169286 (2004-09-01), Shibata
patent: 2007/0164447 (2007-07-01), Ho et al.
patent: 7-211722 (1995-08-01), None
patent: 2002-289768 (2002-10-01), None
J.D.Wu et al., “Electromigration Reliability of SnAgXCuX Flip Chip Interconnects”, 54th Electronic Components and Technol. Conf., 2004, pp. 961-967.

Affiliated with

Also associated with

Rating

Flip chip bonding structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip bonding structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip bonding structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4064647