Flip-chip bonding parts, flip-chip bonding confirmation parts an

Details Flip-chip bonding parts, flip-chip bonding confirmation parts an Flip-chip bonding parts, flip-chip bonding confirmation parts an

1998-12-28

2000-09-12

Ryan, Patrick

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228103, 228203, 29729, B23K 3700

Patent

active

061164933

ABSTRACT:
So as to allow bonding precision to be confirmed on a bonding apparatus, both a confirmation substrate part and a confirmation chip part, which are flip-chip bonding confirmation parts used in the bonding of semiconductor devices that have daisy-chain type patterns, are formed as transparent plate-form members and daisy-chain type patterns are provided thereon.

REFERENCES:
patent: 3696229 (1972-10-01), Angelucci et al.
patent: 4369458 (1983-01-01), Thomas et al.
patent: 5212880 (1993-05-01), Nishiguchi et al.
patent: 5356947 (1994-10-01), Ali et al.
patent: 5790728 (1998-08-01), Wentworth
patent: 5851894 (1998-12-01), Ramm
patent: 5949655 (1999-09-01), Glenn

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