Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-10-03
2006-10-03
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S484000, C257S669000
Reexamination Certificate
active
07115446
ABSTRACT:
A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.
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Kim Hyoung Chan
Koo Ja Uk
Keusey, Tutunjian & & Bitetto, P.C.
Stevenson Andre′
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