Flip chip bonding method for enhancing adhesion force in...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support

Reexamination Certificate

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C438S484000, C257S669000

Reexamination Certificate

active

07115446

ABSTRACT:
A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.

REFERENCES:
patent: 6576499 (2003-06-01), Funaya et al.
patent: 6888230 (2005-05-01), Ogino et al.
patent: 2001/0029088 (2001-10-01), Odajima et al.
patent: 2002/0133943 (2002-09-01), Sakamoto et al.

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