Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
1999-11-23
2001-11-06
Arbes, Carl J. (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S743000, C029S739000, C029S721000, C029S833000, C228S105000
Reexamination Certificate
active
06311391
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a flip-chip bonding apparatus in which a die (semiconductor chip) is inverted and bonded directly to a substrate.
2. Prior Art
Japanese Patent No. 2725701, for instance, discloses a flip-chip bonding apparatus. In this bonding apparatus, bonding is performed in the following manner:
Numerous dies disposed on a wafer sheet with the bumps (electrodes) facing upward are picked up by a vacuum suction chucking nozzle and thus held by vacuum suction. Next, while holding a die by vacuum suction, the vacuum suction chucking nozzle is rotated in the vertical direction by a die inverting device so that the die is inverted. Then, the die held by the vacuum suction chucking nozzle is received by a bonding nozzle, the bonding nozzle transfers the die to the substrate, and the die is bonded to this substrate.
This prior art does not disclose any means for recognizing the die positioned on the wafer sheet that is to be picked up by the vacuum suction chucking nozzle or a means for correcting positional deviation of the die. However, the following type of structure is generally used therefor.
A die inverting device, which has a vacuum suction chucking nozzle, and an optical recognition device, which is positioned at a fixed offset distance from the vacuum suction chucking nozzle in order to recognize the die on the wafer sheet, are mounted on a universally known XY table and wafer holder. The universally known XY table and wafer holder are respectively driven in the X and Y directions and &thgr; direction. Thus, recognition functions including the distinction between a good die and a defective die and the calculation of positional deviation of a good die, etc. are performed by this optical recognition device.
With the above system, the XY table and wafer holder are driven so that an open window (through which an image of a die is taken) provided on the optical recognition device is moved to a point above the die that is to be picked up. Then, after a die is recognized and the positional deviation of the die is calculated, the XY table and the wafer holder are driven with the offset amount between the optical recognition device and the vacuum suction chucking nozzle and the positional deviation of the die added (offset movement), thus moving the vacuum suction chucking nozzle a point above the die that is to be picked up. In this way, the positional deviation of the die is eliminated. Next, the vacuum suction chucking nozzle is lowered, and the die is picked up from the wafer sheet and held by vacuum suction. Next, while holding the die by vacuum suction, the vacuum suction chucking nozzle is rotated by the die inverting device so that the die is inverted as described above. In order to recognize the die that is to be picked up next, the XY table and wafer holder are driven so that the open window of the optical recognition device is moved to a point above the die that is to be picked up.
In the above-described prior art, the die inverting device and the optical recognition device are independently installed on the XY table and wafer holder. As a result, the overall size of the bonding apparatus becomes large. Also, since the optical recognition device is moved with the offset, mechanical error tends to occur during the positioning of the optical recognition device in the X and Y directions. Moreover, it is necessary to move the open window of the optical recognition device to a point above the next die to be picked up after the die has been picked up by the vacuum suction chucking nozzle and the vacuum suction chucking nozzle has been inverted by the die inverting device. Accordingly, die recognition cannot be performed instantly, and it takes a longer production time.
SUMMARY OF THE INVENTION
Accordingly, the first object of the present invention is to provide a flip-chip bonding apparatus which is reduced in overall size and is improved with the precision of recognition of positional deviation of a die.
The second object of the present invention is to provide a flip-chip bonding apparatus in which the overall bonding time can be shortened, thus improving the productivity.
The above objects are accomplished by a unique structure of the present invention for a flip-chip bonding apparatus which comprises: a vacuum suction chucking nozzle which picks up and holds, by means of vacuum suction, a die disposed on a wafer sheet or tray with bumps of the die facing upward; a die inverting device on which the vacuum suction chucking nozzle is provided and which rotates the vacuum suction chucking nozzle, in a state in which the die is held by vacuum suction, in the direction of a die pick-up position and in the direction of a die transfer position so as to invert the upper surface and undersurface of the die; and an optical recognition device which has an open window formed in its undersurface and recognizes an image of the die disposed on the wafer sheet or tray; and in the present invention, the die inverting device is installed on the optical recognition device so that the vacuum suction chucking nozzle can rotate in the direction of the die pick-up position and in the direction of the die transfer position.
The flip-chip bonding apparatus of the present invention is provided with: a rotating member which is installed on the optical recognition device so that the rotating member is rotatable in a vertical plane, and a driving means which is installed on the optical recognition device and rotates the rotating member; and in addition the vacuum suction chucking nozzle is provided on the rotating member so that the vacuum suction chucking nozzle is moved to positionally correspond to the open window of the optical recognition device.
In this structure, the rotating member is comprised of a first gear, and the driving means comprised of a second gear, which engages with the first gear, and a driving source such as a motor, etc. which rotates the second gear.
Furthermore, in the flip-chip bonding apparatus of the present invention, a rotating member which is installed on the optical recognition device so as to be on the same side as the open window so that the rotating member is rotatable in the vertical plane and movable horizontally, and a driving means which is installed on the optical recognition device and rotates the rotating member, are provided; and the vacuum suction chucking nozzle is provided on the rotating member so as to positionally correspond to the open window.
In addition, the flip-chip bonding apparatus of the present invention is provided with: a slider which is installed on the optical recognition device so as to be near the open window and be rotatable and movable horizontally, and a driving means which is installed on the optical recognition device so as to rotate and horizontally move the slider; and the vacuum suction chucking nozzle is provided on the slider, and the driving means rotates the vacuum suction chucking nozzle in the direction of the die pick-up position and in the direction of the die transfer position and causes the vacuum suction chucking nozzle to positionally correspond to the open window of the optical recognition device.
In this structure, the driving means is comprised of: a first gear which is fastened to the slider, a second gear which engages with this first gear, a first driving source which is installed on the optical recognition device so as to be movable horizontally and to rotate the second gear, and a second driving source which is installed on the optical recognition device so as to move the first driving source horizontally.
Furthermore, the above-described objects are accomplished by still another unique structure of the present invention for a flip-chip bonding apparatus which comprises: a vacuum suction chucking nozzle which picks up and holds, by means of vacuum suction, a die disposed on a wafer sheet or tray with bumps of the die facing upward; and an optical recognition device which has an open window formed in its undersurface and recognizes an image o
Fuke Shigeru
Hayata Shigeru
Yokohama Masaki
Arbes Carl J.
Kabushiki Kaisha Shinkawa
Koda & Androlia
Trinh Minh
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