Flip-chip BGA semiconductor device for achieving a superior...

Details Flip-chip BGA semiconductor device for achieving a superior... Flip-chip BGA semiconductor device for achieving a superior...

2005-10-18

2005-10-18

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

Reexamination Certificate

active

06956290

ABSTRACT:
In the flip-chip BGA semiconductor device of the present invention, a stiffener is bonded by means of adhesive on the surface of a substrate on which a semiconductor chip is mounted in the area surrounding the semiconductor chip, and gaps are provided between the substrate and the stiffener that each extend outwardly from positions that confront opposite sides of the semiconductor chip and that communicate with the ends of the substrate. These gaps can be formed by depressions that are provided in the substrate or in the stiffener.

REFERENCES:
patent: 5846851 (1998-12-01), Sasaki et al.
patent: 6224711 (2001-05-01), Carden et al.
patent: 6268646 (2001-07-01), Sugimoto et al.
patent: 6391686 (2002-05-01), Shiozawa
patent: 3-56137 (1991-05-01), None
patent: 10-41350 (1998-02-01), None
patent: 11-284032 (1999-10-01), None

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