Flip chip ball grid array package

Details Flip chip ball grid array package Flip chip ball grid array package

2007-05-29

2007-05-29

Dang, Phuc T. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C438S106000

Reexamination Certificate

active

10678419

ABSTRACT:
A flip-chip ball grid array integrated circuit package with improved thermo-mechanical properties is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. A semiconductor die is flip-chip mounted to the first surface of the substrate and electrically connected to ones of the conductive traces. An intermetallic heat spreader is fixed to a back side of the semiconductor die and a plurality of contact balls are disposed on the second surface of the substrate. The contact balls are in the form of a ball grid array and ones of the contact balls of the ball grid array are electrically connected to ones of the conductive traces.

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Chen et al., Structure and Manufacture of a Heat Sink with High Heat Transmission, Pub. date Aug. 14, 2003, p. 1, [0012].

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