Flip chip attachment

Details Flip chip attachment Flip chip attachment

1997-05-12

1999-02-16

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29832, 29846, 29852, 174265, 216 18, 22818822, 228254, H05K 334

Patent

active

058708227

ABSTRACT:
A flip chip is soldered to an array of flexible pillars of compliant dielectric material on a circuit board. Each pillar has an electrically conductive core electrically coupled to the circuit board. The pillars absorb movement due to differences in the coefficient of thermal expansion of the chip and board, and hence reduce the possibility of fatigue failure of the solder joint. The pillars are manufactured by forming a layer of compliant dielectric material on the circuit board, forming blind holes in the layer, filling the holes with electrically conductive material overlapping the edges of the holes, and then laser ablating to remove the compliant dielectric material except where protected by the electrically conductive material.

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