Flexures and method for creating flexures in a wafer

Details Flexures and method for creating flexures in a wafer Flexures and method for creating flexures in a wafer

1989-02-27

1990-04-24

Powell, William A.

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73514, 156644, 156647, 156651, 156653, 156657, 1566591, 156662, 428137, 428156, H01L 21306, B44C 122

Patent

active

049199935

ABSTRACT:
Flexures, and a method for creating flexures, for use in micromechanical sensors such as accelerometers in which a first member is pivotally connected to a second member. In one aspect, the invention provides first and second flexures connecting the first and second members, the flexures permitting rotation about a common hinge axis. The flexures have a crossed configuration that provides increased stability. Each flexure is made by etching grooves in the opposite wafer surface, the positions and depths of the grooves being selected so as to form a flexure therebetween.

REFERENCES:
patent: 4812199 (1989-03-01), Sickafus

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