Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2008-05-27
2008-05-27
Culbert, Roberts (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C029S890100, C438S021000
Reexamination Certificate
active
07378030
ABSTRACT:
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, filling the trench with a fill material, forming a first portion of the opening in the substrate from the second side of the substrate toward the mask layer, and forming a second portion of the opening in the substrate through the mask layer and the fill material, including communicating the second portion of the opening with the first portion of the opening and the first side of the substrate.
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Haluzak Charles C.
Leith Steven
Truninger Martha A.
Culbert Roberts
Hewlett--Packard Development Company, L.P.
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