Flexible wiring substrate and method for producing the same

Details Flexible wiring substrate and method for producing the same Flexible wiring substrate and method for producing the same

2008-02-28

2010-11-09

Lee, Jinhee J (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

07830667

ABSTRACT:
Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.

REFERENCES:
patent: 5320272 (1994-06-01), Melton et al.
patent: 2002/0048156 (2002-04-01), Saito
patent: 2006/0042826 (2006-03-01), Kondo
patent: 2008/0174975 (2008-07-01), Kurihara
patent: 2009/0068522 (2009-03-01), Kang et al.
patent: 6-342969 (1994-12-01), None
patent: 11-21673 (1999-01-01), None
patent: 2000-36521 (2000-02-01), None
patent: 2001-144145 (2001-05-01), None

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