Flexible wiring board and its fabrication method

Details Flexible wiring board and its fabrication method Flexible wiring board and its fabrication method

1993-10-05

1995-10-24

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174256, 174259, 174260, 174261, 174262, 361749, 361757, H05U 100

Patent

active

054612020

ABSTRACT:
A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on thed printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

REFERENCES:
patent: 4550357 (1985-10-01), Matsumoto
patent: 5132772 (1992-07-01), Fetty
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5294755 (1994-03-01), Kawakami et al.
patent: 5360946 (1994-11-01), Feger et al.

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