Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1997-03-10
1998-03-31
Lusignan, Michael
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 98, 427405, B05D 512
Patent
active
057335982
ABSTRACT:
A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.
REFERENCES:
patent: 4182781 (1980-01-01), Hooper et al.
patent: 4411980 (1983-10-01), Haney et al.
patent: 4559357 (1985-12-01), Matsumoto
patent: 4569902 (1986-02-01), Saito
patent: 4670351 (1987-06-01), Keane et al.
patent: 4734156 (1988-03-01), Iwasa
patent: 4752555 (1988-06-01), Takada et al.
patent: 4898648 (1990-02-01), Cusano
patent: 5132772 (1992-07-01), Fetty
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5294755 (1994-03-01), Kawakami et al.
patent: 5360946 (1994-11-01), Feger et al.
Fukui Toshiharu
Matsui Futoshi
Sera Naoki
Tanabe Kouji
Lusignan Michael
Matsushita Electric - Industrial Co., Ltd.
Talbot Brian K.
LandOfFree
Flexible wiring board and its fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible wiring board and its fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible wiring board and its fabrication method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-49583