Flexible wiring board

Details Flexible wiring board Flexible wiring board

1999-11-17

2001-12-25

Gaffin, Jeffrey (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S256000

Reexamination Certificate

active

06333466

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a flexible wiring board for use in the wiring of electric apparatus, electronic apparatus, etc.
BACKGROUND OF THE INVENTION
A flexible wiring board has good flexing characteristics and thus has heretofore been used in the wiring of electric apparatus and electronic apparatus, particularly in the wiring of mobile members in computer peripheral such as HDD and CD-ROM.
Such a flexible wiring board is prepared, e.g., by laminating a conductor layer such as metal foil on an insulation layer such as plastic film optionally with an adhesive layer of synthetic resin or the like provided interposed therebetween, subjecting the conductor layer to etching or other treatments to form a predetermined circuit pattern thereon, and then laminating an insulation layer on the conductor layer optionally with an adhesive layer provided interposed therebetween.
In recent years, with the enhancement of the performance and improvement in the mobility of electric apparatus and electronic apparatus, particularly computer peripheral, the internal temperature in these apparatus tends to rise more and more. It has thus been desired to develop a flexible wiring board which exhibits a sufficient flex life under working conditions causing such a temperature rise.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a flexible wiring board which exhibits a sufficient flex life under high temperature working conditions.
The foregoing object of the present invention will become apparent from the following detailed description and examples.
The foregoing object of the present invention is accomplished with a flexible wiring board comprises an insulation layer provided on both surfaces of a conductor layer, optionally with an adhesive layer provided interposed therebetween, wherein the layers being in direct contact with both surfaces of the conductor layer exhibit an average complex shear modulus value of from 1.0×10
10
to 4×10
10
dyn/cm
2
at a temperature of 60° C. and a frequency of 25 Hz.
More specifically, the foregoing object of the present invention is accomplished with (1) a flexible wiring board comprising an insulation layer provided on both surfaces of a conductor layer with an adhesive layer provided interposed therebetween, characterized in that the adhesive layers in direct contact with both surfaces of the conductor layer exhibit an average complex shear modulus value of from 1.0×10
10
to 4×10
10
dyn/cm
2
at a temperature of 60° C. and a frequency of 25 Hz,
(2) a flexible wiring board comprising an insulation layer provided on one surface of a conductor layer with an adhesive layer provided interposed therebetween and an insulation layer provided on the other free from adhesive layer, characterized in that the adhesive layer and insulation layer in direct contact with the respective surface of the conductor layer exhibit an average complex shear modulus value of from 1.0×10
10
to 4×10
10
dyn/cm
2
at a temperature of 60° C. and a frequency of 25 Hz, and
(3) a flexible wiring board comprising an insulation layer provided on both surfaces of a conductor layer free from adhesive layer, characterized in that the insulation layers in direct contact with both surfaces of the conductor layer exhibit an average complex shear modulus value of from 1.0×10
10
to 4×10
10
dyn/cm
2
at a temperature of 60° C. and a frequency of 25 Hz.


REFERENCES:
patent: 5084124 (1992-01-01), Taniguchi
patent: 5260518 (1993-11-01), Tanaka et al.
patent: 5615088 (1997-03-01), Mizumo
patent: 5637382 (1997-06-01), Millette et al.
patent: 5880935 (1999-03-01), Wiesa et al.
patent: A-62-115887 (1987-05-01), None
patent: A-2-222193 (1990-09-01), None
patent: A-6-164085 (1994-06-01), None
65-629 A (1999) Influence of Visco Elastic Properties in Plastics Material on the Reliability of Flexible Printed Circuits under Bending (Improvement on Bending Lifetime due to Energy Transformation), 7 pages.

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