Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-09-16
2008-09-16
Dinh, Tuan (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S257000, C174S258000, C174S260000
Reexamination Certificate
active
10519486
ABSTRACT:
The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. The invention also provides a method for producing the flexible wiring substrate.The flexible wiring substrate10includes an insulating substrate11, a wiring pattern12formed on a surface of the insulating substrate11, and a solder resist layer17covering a surface of the wiring pattern12excluding at least terminal portions of the wiring pattern12, at least a portion of the outermost surface of the wiring pattern12which is not covered with the solder resist layer17being provided with a tin-bismuth alloy plating layer26, characterized in that the wiring pattern12comprises a base layer21formed of a conductor and that a first tin plating layer24is provided on the base layer21so as to extend under a region covered with the solder resist layer17and also under a region not covered with the solder resist layer17.
REFERENCES:
patent: 2002/0048156 (2002-04-01), Saito
patent: 6-342969 (1994-12-01), None
patent: 11-21673 (1999-01-01), None
patent: 2000-36521 (2000-02-01), None
patent: 2001-144145 (2001-05-01), None
Dinh Tuan
Getachew Abiy
Mitsui Mining & Smelting Co. Ltd.
Sughrue & Mion, PLLC
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