Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-03-21
1998-10-06
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361750, 361751, 361767, 361779, 257737, 257738, 257700, 257774, 257778, 257779, 439 66, 439 83, 174254, 174255, H05K 114
Patent
active
058186972
ABSTRACT:
An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.
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Armezzani Gregg Joseph
Ives Robert Nicholas
Pierson Mark Vincent
Tull Terry Alan
Foster David
Fraley Lawrence R.
International Business Machines - Corporation
Picard Leo P.
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