Flexible substrate with electronic devices formed thereon

Details Flexible substrate with electronic devices formed thereon Flexible substrate with electronic devices formed thereon

2011-06-21

2011-06-21

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C257SE21242

Reexamination Certificate

active

07964507

ABSTRACT:
A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).

REFERENCES:
patent: 5237436 (1993-08-01), Khan et al.
patent: 5891552 (1999-04-01), Lu et al.
patent: 6492026 (2002-12-01), Graff et al.
patent: 6680485 (2004-01-01), Carey et al.
patent: 6762124 (2004-07-01), Kian et al.
patent: 7045442 (2006-05-01), Maruyama et al.
patent: 7110163 (2006-09-01), Webber et al.
patent: 7235736 (2007-06-01), Buller et al.
patent: 7351377 (2008-04-01), Chazan et al.
patent: 2003/0043450 (2003-03-01), Liang et al.
patent: 2003/0071794 (2003-04-01), Arakawa et al.
patent: 2003/0193796 (2003-10-01), Heeks et al.
patent: 2004/0079941 (2004-04-01), Yamazaki et al.
patent: 2005/0150589 (2005-07-01), Amos et al.
patent: 2005/0158665 (2005-07-01), Maekawa et al.
patent: 2005/0163968 (2005-07-01), Hanket
patent: 2005/0216075 (2005-09-01), Wang et al.
patent: 2006/0113894 (2006-06-01), Fujii et al.
patent: 2006/0180890 (2006-08-01), Naugler, Jr. et al.
patent: 2007/0002199 (2007-01-01), Fujikawa et al.
patent: 2007/0035808 (2007-02-01), Amundson et al.
patent: 2007/0272124 (2007-11-01), Tsutsumi et al.
patent: 2010/0038020 (2010-02-01), Hori et al.
patent: 2 430 547 (2007-03-01), None

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