Flexible substrate, semiconductor device, imaging device,...

Details Flexible substrate, semiconductor device, imaging device,... Flexible substrate, semiconductor device, imaging device,...

2005-06-21

2005-06-21

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S736000

Reexamination Certificate

active

06909173

ABSTRACT:
The invention concerns a flexible substrate comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides a semiconductor device comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides for a manufacturing method a semiconductor device comprising a substrate, an external connection terminal, and an inner lead with a base film. Further, the invention provides a semiconductor device with a substrate with a chamfered corner between the connection and side faces. By the invention, connection of an inner lead or a flexible substrate is made easier.

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patent: 2000-235629 (2000-08-01), None
patent: 2001-90278 (2001-04-01), None

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