Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2000-05-03
2001-10-09
Bell, Bruce F. (Department: 1741)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S297070, C204S279000, C204S287000
Reexamination Certificate
active
06299745
ABSTRACT:
FIELD OF THE INVENTION
The field of the invention is flexible substrate plating racks.
BACKGROUND OF THE INVENTION
When electroplating a substrate it is common to attach the substrate to a rack to facilitate movement of the substrate. For a rigid substrate, the substrate is typically attached by clamping one edge of the substrate to one side of the rack. In such an instance, the rigidity of the substrate is sufficient to maintain the body of the substrate in position even though only one edge is fastened to the rack.
A common clamp used for rigid substrates is the screw-down type in which a threaded shaft acts in the manner of a set screw and is turned so that it contacts the substrate and presses the substrate against a portion of the clamp to hold it in place. Such a clamp is generally used to form an electrical connection between a conductive/seed layer on the substrate and a power source such that the seed layer acts as an electrode during electroplating.
Methods and devices for rigid substrates are generally unsuitable for use with flexible substrates. One difficulty encountered in applying rigid substrate methods to flexible substrates is that the method of clamping a rigid substrate to a substrate rack tends to damage the substrate. Another difficulty is that the current levels used for a rigid substrates tend to burn off the conductive/seed layers of a flexible substrate. Thus, there is a continuing need for new methods and devices for use in electroplating flexible substrates.
SUMMARY OF THE INVENTION
The present invention is directed to a rack suitable for holding a flexible substrate panel. A rectangular rack having seven clamps is used to hold a flexible substrate panel bearing a copper seed or other conductive layer in place wherein one tautens the substrate while attaching the clamps so as to clamp the substrate in a “wrinkle free” manner. The seven clamps are arranged with 3 clamps on each of the left and right sides and one clamp on the bottom, the clamps making electrical contact with conductive layers of both the front and back surfaces of the substrate panel. The arrangement of the clamps provides adequate support to the substrate, provides for a good and uniform current distribution on the substrate, and allows a relatively large amount of current to flow through the panel without burning off the conductive/seed layers. In one rack, a spring clamp biased open is used wherein a thumbscrew is tightened against a surface of the clamp to force it against its spring into a closed, clamping position. The use of the spring clamp prevents the rotating pressure point contact of the thumbscrew from causing damage to the conductive seed layer such as by tearing into the flexible substrate.
Various objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the invention, along with the accompanying drawings in which like numerals represent like components.
REFERENCES:
patent: 4820396 (1989-04-01), de Masi
patent: 4871436 (1989-10-01), den Hartog
patent: 5076903 (1991-12-01), Westin
patent: 5527435 (1996-06-01), Arnau
patent: 6071388 (2000-06-01), Uzoh
Kumar Raj
Rattey Cheryle
Bell Bruce F.
Brueske Curtis B.
Honeywell International , Inc.
LandOfFree
Flexible substrate plating rack does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible substrate plating rack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible substrate plating rack will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2571024