Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-11-01
1995-01-31
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 174254, 361704, 361707, 361710, 361711, 361719, 361720, 361760, 361807, 361792, 361809, 361810, 439 66, H05K 720, H05K 100
Patent
active
053863410
ABSTRACT:
Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.
REFERENCES:
patent: 3967162 (1976-06-01), Ceresa et al.
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4792879 (1988-12-01), Bauknecht et al.
patent: 4811165 (1989-03-01), Currier et al.
patent: 5007842 (1991-04-01), Deak et al.
patent: 5101322 (1992-03-01), Ghaem et al.
Electronic Packaging and Production May 1992 p. 46.
Currier David W.
Fulcher Mark
Klosowiak Tomasz L.
Olson William L.
Melamed Phillip H.
Motorola Inc.
Picard Leo P.
Sparks Donald A.
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