Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-06-14
2005-06-14
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S787000, C257S731000, C257S729000, C257S698000, C438S125000
Reexamination Certificate
active
06906412
ABSTRACT:
A sensor package P is a surface-mounted sensor package which is adapted to be mounted on a printed board200. The sensor package P includes a case1for accommodating a semiconductor acceleration sensor chip100having output pads101. The case has a bottom wall10, which is divided into a center area10afor supporting the sensor chip100and a peripheral area10b. Output electrodes15to be connected to the output pads101are formed on external surfaces of the peripheral area. These output electrodes15are soldered to the printed board200for electrical connection between the sensor chip and an electric circuit of the printed board as well as for holding the sensor package physically on the printed board. The feature of the present invention resides in that grooves12are formed in an interior surface of the bottom wall10between the center area10aand the peripheral area10b.
REFERENCES:
patent: 5406454 (1995-04-01), Dinger et al.
patent: 6111199 (2000-08-01), Wyland et al.
patent: 6249049 (2001-06-01), Kamada et al.
patent: 6388311 (2002-05-01), Nakashima et al.
patent: 6448624 (2002-09-01), Ishio et al.
patent: 06-289048 (1994-10-01), None
patent: 10-062446 (1998-03-01), None
patent: 11-260960 (1999-09-01), None
patent: 11-281667 (1999-10-01), None
patent: 2000-046859 (2000-02-01), None
patent: 2001-337104 (2001-12-01), None
Internatioanal Search Report for PCT/JP03/06784 mailed on Sep. 30, 2003.
Furukubo Eiichi
Hori Masami
Nohara Kazuya
Flynn Nathan J.
Matsushita Electric & Works Ltd.
Wilson Scott R.
LandOfFree
Flexible sensor package responsive to thermally induced... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible sensor package responsive to thermally induced..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible sensor package responsive to thermally induced... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3464109