Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate
2008-12-31
2011-11-01
Cao, Phat (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
C257S784000
Reexamination Certificate
active
08049332
ABSTRACT:
A flexible semiconductor package apparatus having a responsive bendable conductive wire member is presented. The apparatus includes a flexible substrate, semiconductor chips, and conductive wires. The semiconductor chips are disposed on the flexible substrate and spaced apart from each other on the flexible substrate. Each semiconductor chip has bonding pads. The conductive wires are electrically connected to the bonding pads of the semiconductor chip. Each conductive wire has at least one elastic portion. One preferred configuration is that part of the conductive wire is wound to form a coil spring shape so that the coil spring shape of the conductive wire aid in preventing the conductive wire from being separated from the corresponding bonding pad of the semiconductor chip when the flexible substrate on which the semiconductor chips are mounted are bent, expanded or twisted.
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Kim Sung Min
Oh Tac Keun
Cao Phat
Hynix / Semiconductor Inc.
Ladas & Parry LLP
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