Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-06-12
2007-06-12
Vu, Hien (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S091000
Reexamination Certificate
active
11139846
ABSTRACT:
Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
REFERENCES:
patent: 4109378 (1978-08-01), Davies
patent: 4421370 (1983-12-01), Treakle et al.
patent: 5035628 (1991-07-01), Casciotti et al.
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5214563 (1993-05-01), Estes
patent: 5679928 (1997-10-01), Okano et al.
patent: 5879172 (1999-03-01), McKenna-Olson et al.
patent: 5959355 (1999-09-01), Petit
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 5984692 (1999-11-01), Kumagai et al.
patent: 6019610 (2000-02-01), Glatts, III
patent: 6027346 (2000-02-01), Sinsheimer et al.
patent: 6077091 (2000-06-01), McKenna-Olson et al.
patent: 6204455 (2001-03-01), Gilleo et al.
patent: 6224394 (2001-05-01), Matsumoto
patent: 6686015 (2004-02-01), Raab et al.
patent: 6716037 (2004-04-01), Kung et al.
patent: 6722896 (2004-04-01), McGrath et al.
patent: 6840777 (2005-01-01), Sathe et al.
patent: 6873168 (2005-03-01), Kazama
patent: 6939142 (2005-09-01), Maruyama et al.
patent: 2001/0016433 (2001-08-01), Pieper
patent: 2004/0002234 (2004-01-01), Masao et al.
patent: 2005/0266703 (2005-12-01), Noda et al.
patent: 2005/0277309 (2005-12-01), Noda et al.
patent: 1049205 (2000-11-01), None
patent: 1315244 (2003-05-01), None
patent: 1381116 (2004-01-01), None
patent: 6-333624 (1994-12-01), None
IBM Technical Disclosure Bulletin, vol. 22, No. 6, Nov. 1979, pp. 2286-2287.
IBM Technical Disclosure Bulletin, vol. 18, No. 9, Feb. 1976, p. 2817.
International Search report of copending International Patent Application Serial No. PCT/US2005/018941, Sep. 30, 2005.
Hoshikawa Shigeyuki
Ichijo Yasuhiro
Noda Atsuhito
Molex Incorporated
Paulius Thomas D.
Vu Hien
LandOfFree
Flexible ring interconnection system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible ring interconnection system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible ring interconnection system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3822060