Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-09-25
2007-09-25
Vu, Hien (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S091000
Reexamination Certificate
active
11657995
ABSTRACT:
Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
REFERENCES:
patent: 4109378 (1978-08-01), Davies
patent: 4421370 (1983-12-01), Treakle et al.
patent: 5035628 (1991-07-01), Casciotti et al.
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5199889 (1993-04-01), McDevitt
patent: 5214563 (1993-05-01), Estes
patent: 5679928 (1997-10-01), Okano et al.
patent: 5879172 (1999-03-01), McKenna-Olson et al.
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 5984692 (1999-11-01), Kumagai et al.
patent: 6019610 (2000-02-01), Glatts, III
patent: 6027346 (2000-02-01), Sinsheimer et al.
patent: 6077091 (2000-06-01), McKenna-Olson et al.
patent: 6204455 (2001-03-01), Gilleo et al.
patent: 6224394 (2001-05-01), Matsumoto
patent: 6686015 (2004-02-01), Raab et al.
patent: 6716037 (2004-04-01), Kung et al.
patent: 6722896 (2004-04-01), McGrath et al.
patent: 6840777 (2005-01-01), Sathe et al.
patent: 6873168 (2005-03-01), Kazama
patent: 6939142 (2005-09-01), Maruyama et al.
patent: 2001/0016433 (2001-08-01), Pieper
patent: 2003/0003784 (2003-01-01), Neidich
patent: 2004/0002234 (2004-01-01), Masao et al.
patent: 2005/0266703 (2005-12-01), Noda et al.
patent: 2005/0277309 (2005-12-01), Noda et al.
patent: 1049205 (2000-11-01), None
patent: 1315244 (2003-05-01), None
patent: 1381116 (2004-01-01), None
patent: 3236975 (2001-10-01), None
International Search Report of copending International Patent Application No. PCT/US2005/018941, Sep. 30, 2005.
Hoshikawa Shigeyuki
Ichijo Yasuhiro
Noda Atsuhito
Molex Incorporated
Paulius Thomas D.
Vu Hien
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