Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-08-16
2005-08-16
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S753000, C257S783000, C257S780000, C257S778000, C430S314000, C174S254000, C174S259000, C174S260000
Reexamination Certificate
active
06930390
ABSTRACT:
An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps.A resin coating21and a resist film24are formed in this order on the surface of a metal film11and on the surface of each metal bump16formed on the metal film11, and a pressure is applied on the surface to depress the resist film24on the metal bump16, followed by etching. As the surface of the resin coating21is partially exposed at the depressed portion of the resist film24, etching of the resin coating21proceeds from that portion to bulge the surface of the metal bump16from the resin coating21. If the resist film24is formed after a flexible resin coating22is formed on the rigid resin coating21, the flexible resin coating22can serve as an adhesive layer.
REFERENCES:
patent: 5600103 (1997-02-01), Odaira
patent: 5641113 (1997-06-01), Somaki
patent: 5908317 (1999-06-01), Heo
patent: 6042682 (2000-03-01), Funaya
patent: 6054171 (2000-04-01), Shoji
patent: 6063647 (2000-05-01), Chen et al.
patent: 6212768 (2001-04-01), Murakami
patent: 6255737 (2001-07-01), Hashimoto
patent: 6448633 (2002-09-01), Yee et al.
patent: 6475896 (2002-11-01), Hashimoto
patent: 6-112274 (1994-04-01), None
patent: 06-216258 (1994-08-01), None
patent: 7-183646 (1995-07-01), None
patent: 08-111583 (1996-04-01), None
patent: 10-321990 (1998-12-01), None
patent: A-2000-12622 (2000-01-01), None
Notification of Reason(s) for Refusal for JP Patent Application No. Hei 11-011422.
Hishinuma Hiroyuki
Kaneda Yutaka
Tsutsumi Akira
Erdem Fazli
Flynn Nathan J.
Oliff & Berridg,e PLC
Sony Chemicals Corp.
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