Flexible printed wiring boards

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Details

C257S753000, C257S783000, C257S780000, C257S778000, C430S314000, C174S254000, C174S259000, C174S260000

Reexamination Certificate

active

06930390

ABSTRACT:
An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps.A resin coating21and a resist film24are formed in this order on the surface of a metal film11and on the surface of each metal bump16formed on the metal film11, and a pressure is applied on the surface to depress the resist film24on the metal bump16, followed by etching. As the surface of the resin coating21is partially exposed at the depressed portion of the resist film24, etching of the resin coating21proceeds from that portion to bulge the surface of the metal bump16from the resin coating21. If the resist film24is formed after a flexible resin coating22is formed on the rigid resin coating21, the flexible resin coating22can serve as an adhesive layer.

REFERENCES:
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patent: 5641113 (1997-06-01), Somaki
patent: 5908317 (1999-06-01), Heo
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patent: 10-321990 (1998-12-01), None
patent: A-2000-12622 (2000-01-01), None
Notification of Reason(s) for Refusal for JP Patent Application No. Hei 11-011422.

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