Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-05-31
2005-05-31
Zarneke, David (Department: 2829)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S778000, C438S108000
Reexamination Certificate
active
06900989
ABSTRACT:
The present invention provides a printed circuit board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the printed circuit board. The printed circuit board contains a flexible printed wiring board and a semiconductor chip mounted on the flexible printed wiring board, wherein the flexible printed wiring board includes: an insulating layer12and a wiring pattern21formed of a conductor layer11provided on at least one side of the insulating layer12and a releasing layer13provided on a surface of the insulating layer12, which surface is opposite to the mounting side of the semiconductor chip.
REFERENCES:
patent: 6280851 (2001-08-01), Pasternack et al.
patent: 6441474 (2002-08-01), Naitoh et al.
patent: 2002-289651 (2002-10-01), None
Geyer Scott B.
Mitsui Mining & Smelting Co. Ltd.
Sughrue & Mion, PLLC
Zarneke David
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