Flexible printed wiring board for chip-on flexibles

Details Flexible printed wiring board for chip-on flexibles Flexible printed wiring board for chip-on flexibles

2006-01-10

2006-01-10

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S612000, C428S618000, C428S626000, C428S658000, C428S674000, C428S687000, C428S344000, C428S353000, C156S150000, C156S242000, C156S325000

Reexamination Certificate

active

06984456

ABSTRACT:
There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 μm, and the specular gloss was made to be 250 or more when the incident angle is 60°.

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patent: 5833819 (1998-11-01), Ohara et al.
patent: 5863666 (1999-01-01), Merchant et al.
patent: 7-231161 (1995-08-01), None
patent: 2000-269637 (2000-09-01), None
patent: 2003-23046 (2003-01-01), None

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