Flexible printed wiring board and manufacturing method thereof

Details Flexible printed wiring board and manufacturing method thereof Flexible printed wiring board and manufacturing method thereof

2005-05-18

2008-09-23

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S748000

Reexamination Certificate

active

07427717

ABSTRACT:
A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion. A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.

REFERENCES:
patent: 2002/0009578 (2002-01-01), Watanabe et al.
patent: 2003/0151902 (2003-08-01), Kageyama et al.
patent: 104256 (1998-01-01), None

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