Flexible printed substrate

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428212, 4284735, 428901, B32B 900

Patent

active

053744691

ABSTRACT:
A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

REFERENCES:
patent: 4725484 (1988-02-01), Kumagawa
patent: 4746561 (1988-05-01), Kudinger et al.
patent: 4769270 (1988-09-01), Nagamatsu et al.
patent: 4792476 (1988-12-01), Numata et al.
patent: 4906515 (1990-03-01), Inoguchi
patent: 4939039 (1990-07-01), Watanabe
patent: 4946734 (1990-08-01), Sugawara et al.
patent: 4963425 (1990-10-01), Buchanan et al.
patent: 4985293 (1991-01-01), Keep
patent: 5102722 (1992-04-01), Iida et al.
Printed Circuits Handbook, Coombs ed., 1988 pp. 7.1-7.2.

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