Flexible printed polymer lead frame

Details Flexible printed polymer lead frame Flexible printed polymer lead frame

1993-08-27

1995-10-03

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 257676, 361813, 29827, H05K 118

Patent

active

054553946

ABSTRACT:
A polymer lead frame is made from a flexible substrate with flexible conductive traces. The generally square lead frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

REFERENCES:
patent: 4234666 (1980-11-01), Gursky
patent: 4677526 (1987-06-01), Muehling
patent: 5341027 (1994-08-01), Park et al.

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