Flexible printed circuit layout and method thereof

Details Flexible printed circuit layout and method thereof Flexible printed circuit layout and method thereof

2008-07-25

2010-02-23

Lee, Jinhee J (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C174S263000, C174S264000, C174S265000, C174S266000, C029S846000, C029S847000

Reexamination Certificate

active

07667141

ABSTRACT:
The present invention discloses a flexible printed circuit (FPC) layout and a method thereof. The flexible printed circuit (FPC) layout method comprises steps of: providing a circuit board body; disposing at least an electroplating point on the circuit board body; disposing a plurality of solder pads on the circuit board body, the plurality of solder pads comprising at least a first solder pad and at least a second solder pad being connected respectively to the electroplating point through an internal wire, the first solder pad being further connected to an electroplating zone on the circuit board body through an external wire; performing an electroplating process from the electroplating zone through the external wire so that the external wire, the first solder pad connected to the external wire, the electroplating point connected through the internal wire to the first solder pad, and the second solder pad connected through the internal wire to the electroplating point are electroplated and electrically connected; and providing at least a via hole at the electroplating point on the circuit board body to form an open circuit between the first solder pad and the second solder pad. By using the disclosed method, the flexible printed circuit layout of the present invention can be formed.

REFERENCES:
patent: 5326990 (1994-07-01), Mita et al.
patent: 5428889 (1995-07-01), Mita et al.
patent: 5892661 (1999-04-01), Stafford et al.
patent: 6111306 (2000-08-01), Kawahara et al.

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