Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-06-10
2008-06-10
Hammond, Briggitte R. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07384272
ABSTRACT:
The present invention relates to a flexible printed circuit board assembly. A flexible printed circuit board assembly of the present invention comprises a flexible printed circuit board having a plurality of circuit patterns; a connector mounted at a location spaced apart by a certain distance from an end of the flexible printed circuit board and electrically connected to the, circuit patterns; and a stiffener attached to a region on a bottom surface of the flexible printed circuit board below the connector and having a size corresponding to that of the connector. A connector inside portion and a connector outside portion of the flexible printed circuit board located inside and outside with respect to the connector can be bent. The connector outside portion is bent and bonded to a bottom surface of the stiffener, and the connector inside portion is bent and bonded to a bottom surface of the connector outside portion.
REFERENCES:
patent: 4416497 (1983-11-01), Brandsness et al.
patent: 5616050 (1997-04-01), Suski
patent: 6483713 (2002-11-01), Samant et al.
Birch & Stewart Kolasch & Birch, LLP
Hammond Briggitte R.
LG Electronics Inc.
LandOfFree
Flexible printed circuit board assembly, method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible printed circuit board assembly, method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible printed circuit board assembly, method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2807650