Flexible printed circuit board and process for producing the...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Reexamination Certificate

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C428S675000, C428S901000

Reexamination Certificate

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10516576

ABSTRACT:
The present invention relates to a flexible printed circuit board which has extremely high adhesion performance and on which very fine circuit patterns can be formed by etching, and to a method for producing the same. In the present invention, in the flexible printed circuit board wherein a copper thin film made of copper or an alloy containing primarily copper is directly formed on at least one side of a plastic film substrate, and copper is formed further on the copper thin film by the electrolytic plating method, the above-mentioned copper thin film has a two-layer structure in which a layer including at least a crystalline structure is formed on the surface side thereof, and the X-ray relative intensity ratio between crystal lattice plane indices (200)/(111) in the above-mentioned crystalline structure is 0.1 or less.

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patent: 01321687 (1989-12-01), None
patent: 5-136548 (1993-06-01), None
patent: 05136548 (1993-06-01), None
patent: 5-230643 (1993-09-01), None
patent: 08330728 (1996-12-01), None
patent: 9-51163 (1997-02-01), None
patent: 09051163 (1997-02-01), None
patent: 2000-508265 (2000-07-01), None
patent: 2001-151916 (2001-06-01), None
patent: 2001151916 (2001-06-01), None
patent: WO 97/38851 (1997-10-01), None

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