Flexible printed circuit board and coverlay film and method of m

Details Flexible printed circuit board and coverlay film and method of m Flexible printed circuit board and coverlay film and method of m

1990-04-27

1992-01-28

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29829, 174259, 174254, 428463, 428460, 4284735, 428901, C09J 504

Patent

active

050841246

ABSTRACT:
Disclosed herein is a flexible printed circuit board and coverlay film and a method for producing the same. The board and coverlay film have metal foil or parting paper adhered to a polyimide film using a two-layer thermosetting adhesive. The first layer of adhesive on the polyimide film is about 5 .mu.m thick or less. The circuit board and coverlay film produced according to this invention have excellent bonding strength, thermal, chemical and weather resistance, as well as good insulating properties.

REFERENCES:
patent: 4492730 (1985-01-01), Oishi et al.
patent: 4504607 (1985-03-01), Leech
patent: 4762747 (1988-08-01), Liu et al.

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