Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2002-06-05
2004-11-23
Cuneo, Kamand (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000, C029S843000
Reexamination Certificate
active
06822169
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a flexible printed circuit board and its connecting method to another printed circuit board by soldering.
BACKGROUND OF THE INVENTION
In JP Patent Publication No. H07-29/542, a method for connecting a flexible printed circuit board (hereinafter referred to as “FPCB”) to another printed circuit board (hereinafter referred to as “PCB”) by soldering is disclosed.
FIG. 10
shows this connecting method. FPCB
100
has a through hole
105
as shown in FIG.
10
. (In solder land part
7
) of PCB
2
, protrusive solder layer
8
is formed in advance, whereto the through hole
105
of FPCB
100
is engaged. By engaging the protrusive part of the solder layer
8
with the through hole
105
, both FPCB
100
and PCB
2
are aligned with each other. In this state, heating solder layer
8
higher than its melting temperature enables FPCB
100
to connect with another PCB
2
.
The above connecting method however, has left the following problems because the soldering area is very small. People could not determine from the appearance whether the entire solder land part had connected completely or not to the through whole part. Therefore, time was wasted by confirming the soldering completeness between boards. Further, the connecting intensity might not always be sufficient.
SUMMARY OF THE INVENTION
In a FPCB that has a through hole in the solder land part of the pattern layer between the cover layer and the base layer, the diameter of the through hole in the pattern layer is smaller than holes in the cover layer and the base layer. The solder land part in the FPCB provides the electrical connection part of the pattern layer, which corresponds with holes in the cover layer and base layer. The difference of the diameter of the holes, leads to an increased connecting area for soldering a FPCB to a PCB providing an accurate and strong soldering connection.
REFERENCES:
patent: 5821624 (1998-10-01), Pasch
patent: 6285081 (2001-09-01), Jackson
patent: 6414248 (2002-07-01), Sundstrom
patent: 04-053179 (1992-02-01), None
patent: 07-297542 (1995-11-01), None
patent: 08-032194 (1996-02-01), None
patent: 09-148732 (1997-06-01), None
patent: 10-075029 (1998-03-01), None
Cuneo Kamand
Matsushita Electric - Industrial Co., Ltd.
Norris Jeremy
RatnerPrestia
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