Flexible printed-circuit base board and process for producing th

Details Flexible printed-circuit base board and process for producing th Flexible printed-circuit base board and process for producing th

1990-07-24

1992-05-12

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

Of metal

428447, 428901, 361398, 528 26, B32B 900

Patent

active

051126940

ABSTRACT:
A flexible double-sided copper-clad printed-circuit base board is provided with a core resin layer of a composite material essentially composed of a specific rigid-structured polyimide and a specific flexible-structured crosslinked polyimide silicone in a state of being inseparable from each other, wherein the core resin layer is formed directly between two copper foils. This base board is produced by coating a surface of a copper foil with a polyamic acid solution mixture of a specific polyamic acid and a specific polyamic acid - alkylsilane, heat-treating the resulting coated copper foil, and contact-bonding another copper foil to the resulting copper-foil/polyimide laminate.

REFERENCES:
patent: 4609700 (1986-09-01), Kuniz more et al.
patent: 4981940 (1991-01-01), Konotsone et al.

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