Flexible printed board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C349S150000

Reexamination Certificate

active

07968798

ABSTRACT:
A base layer of a bent portion of a FPC is formed on the front side thereof with second ground bent lines arranged in a mesh pattern and third ground bent lines intersecting with the second ground bent lines in a lateral direction, and on the back side thereof with first ground bent lines along the bending direction. The first ground bent lines are electrically connected to the second ground bent lines and the third ground bent lines via through holes.

REFERENCES:
patent: 6486412 (2002-11-01), Kato
patent: 6507100 (2003-01-01), Valluri et al.
patent: 6559377 (2003-05-01), Noda et al.
patent: 7129416 (2006-10-01), Steinfeld et al.
patent: 2006/0109394 (2006-05-01), Miyagawa et al.
patent: 5-41171 (1993-06-01), None
patent: 9-275251 (1997-10-01), None
patent: 11-298094 (1999-10-01), None
patent: 2002-33556 (2002-01-01), None
patent: 2004-88020 (2004-03-01), None
patent: 2006-18134 (2006-01-01), None
Notice of Submission of Argument issued by the Korean Patent Office on Sep. 14, 2009, for Korean Patent Application No. 10-2007-0115210, and abridged English-language translation thereof.
Notification of Reasons for Refusal issued by the Japanese Patent Office on Dec. 2, 2008, for Japanese Patent Application No. 2006-307933, and English-language translation thereof.

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