Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-10-16
1998-09-01
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156252, 1563077, 361749, 29830, C25D 556
Patent
active
058006508
ABSTRACT:
Flexible multilayer printed circuit boards are disclosed which utilize adhesiveless laminates interconnected in a generally superposed relationship by a conductive adhesive. In one embodiment, the adhesiveless laminates have relatively thin conductive layers and metallized through holes which exhibit high delamination resistance. The metallized through holes preferably have a thickness of at most about 25 microns, yet they are capable of withstanding multilayer assembly processes. High flexibility, reliability, packaging density, and environmental resistance are consequently available in a thin multilayer construction. In a further embodiment, adhesiveless dielectric layers are interposed between adhesiveless laminates to electrically insulate portions thereof. The adhesiveless dielectric layers may define relatively small apertures therein, thus providing greater packaging density for a multilayer printed circuit board.
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Anderson David Allen
Myers Carol Rita
Saari Matthew John
Ball Michael W.
Sheldahl Inc.
Tolin Michael A.
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