Flexible multilayer printed circuit assembly with reduced...

Details Flexible multilayer printed circuit assembly with reduced... Flexible multilayer printed circuit assembly with reduced...

2011-07-12

2011-07-12

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C029S852000, C361S816000

Reexamination Certificate

active

07977582

ABSTRACT:
A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.

REFERENCES:
patent: 5586011 (1996-12-01), Alexander
patent: 5639989 (1997-06-01), Higgins, III
patent: 6191475 (2001-02-01), Skinner et al.
patent: 2007/0000685 (2007-01-01), Inoue

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