Flexible multilayer polymide laminates

Details Flexible multilayer polymide laminates Flexible multilayer polymide laminates

1986-02-24

1987-10-13

Buffalow, Edith

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428349, 428383, 428379, 428421, 528351, B32B 1508

Patent

active

046998411

ABSTRACT:
A multilayer laminate having at least one layer of a no longer formable fully aromatic polyimide and at least one layer of substrate material, the layer of no longer formable polyimide adhering directly on one side to the layer of substrate material with a peel strength of at least 4.0 N/cm. The layer of no longer also formable polyimide is also insoluble in phenolic solvents, has a tensile strength of from 100 to 150 N/mm.sup.2, a breaking elongation of from 15 to 100%, a dielectric dissipation factor of from 1.5.times.10.sup.-3 to 5.times.10.sup.-3 at 1 kHz. Additionally, a layer of heat-sealable high-temperature adhesive selected from the class of polyacrylates, polysulfone resins, epoxy resins, fluoropolymer resins, silicone resins or butyl rubbers is joined to that side of the polyimide layer which is remote from the substrate material.

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Handbook of Adhesives, 2nd Edition, Irving Skeist, pp. 597-618.
"Chemistry and Industry", Jul. 1969, pp. 934 to 939; Perfluoroalkylene-Linked Aromatic Polymers, by J. P. Critchley V. C. R. McLoughlin, J. Thrower and I. M. White.

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