Flexible multi-layer polyimide film laminates and preparation th

Details Flexible multi-layer polyimide film laminates and preparation th Flexible multi-layer polyimide film laminates and preparation th

1992-05-05

1994-03-29

Thibodeau, Paul J.

Stock material or miscellaneous articles

Composite

Of metal

4284735, B32B 1508

Patent

active

052983315

ABSTRACT:
Flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.

REFERENCES:
patent: 3576691 (1971-04-01), Meyers
patent: 3822175 (1974-07-01), Yaun
patent: 3900662 (1975-08-01), Yaun
patent: 4543295 (1985-09-01), St. Clair et al.
patent: 4675246 (1987-06-01), Kundinger et al.
patent: 4837300 (1989-06-01), St. Clair et al.

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