Flexible multi-layer circuit wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

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Details

174254, 361774, H05R 102

Patent

active

054080525

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a flexible circuit wiring board and, particularly, to a flexible multi-layer circuit wiring board having circuit conductors which form finger lead terminals which extend outwardly from edge regions of the board.


BACKGROUND ART

It is known in the art for a flexible circuit wiring board have circuit wiring conductors outwardly protruding in the form of finger leads. An example of such a prior art circuit board is shown in FIGS. 3 and 4. In the circuit board of FIGS. 3 and 4, the protruding circuit wiring conductors 11 are composed of rolled copper or electrolytic copper and may be called TAB leads. These TAB leads extend beyond the edge of an aperture or window 12 that is formed in a flexible insulating base member 13 for connection to a device, i.e., an electrical circuit component.
In the above-mentioned flexible circuit wiring board of conventional structure, the circuit wiring conductors 11 must be so strong that the inner leads protruding into the aperture 12 will not be easily deformed. Because of this reason, it is not allowed to finely form the circuit wiring conductors 11 i.e., high contact density is not possible.
In order to solve such a problem, it can be contrived to form the circuit wiring conductors 11 using an indium-copper alloy or the like instead of a traditional material such as rolled copper or electrolytic copper. This method, however, is not desirable since it impairs flexibility of the flexible circuit wiring board.


DISCLOSURE OF THE INVENTION

The present invention provides a flexible multi-layer circuit wiring board characterized by finger lead-like terminals which resist unintended deformation, even when the associated conductors of the board are finely formed and the board is capable of maintaining good flexibility, even at bent portions.
In a flexible multi-layer circuit wiring board according to the present invention, conductive members comprised of an electrically conducting metal having a large Young's modulus are disposed on one surface of a flexible insulating base member adjacent an edge region of the base member so as to form finger lead-like terminals. The required circuit wiring conductors of the circuit, comprised of a highly flexible and electrically conducting metal, are disposed on the other surface of the flexible and insulating base member. These wiring conductors extend along the base member in regions where there are no terminal forming conductive members, including regions where the circuit wiring board is bent to form a radius. Through hole electric connections are formed to electrically connect required portions of the terminal defining conductive members and the circuit wiring conductors.
The circuit conductors for forming the finger lead-like terminals are disposed on the portions of the circuit wiring board other than the bent portion thereof.


BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a sectional view which schematically illustrates major portions of a flexible multi-layer circuit wiring board in accordance with an embodiment of the present invention;
FIG. 2 is a perspective view which schematically illustrates the finger lead-like terminals of the circuit board of FIG. 1;
FIG. 3 is a top plan view which depicts the prior art; and
FIG. 4 is a cross-sectional side elevation view of a prior art circuit board taken along line Y--Y of FIG. 3.


BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is a sectional view which schematically illustrates major portions of a flexible multi-layer circuit wiring board constituted according to an embodiment of the present invention, and FIG. 2 is a perspective view of finger lead-like terminals.
In these drawings, reference numeral 1 denotes a flexible and insulating base member of a polyimide film or the like, and reference numeral 2 denotes a required number of circuit conductors made of an electrically conducting metal having a large Young's modulus such as an indium-copper alloy or the like. The conductors 2 are supported on one surface of base member 1 and partly pr

REFERENCES:
patent: 4858073 (1989-08-01), Gregory
patent: 4949225 (1990-08-01), Sagisaka
patent: 5057907 (1991-10-01), Ooi et al.

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