Metal fusion bonding – Solder form
Patent
1994-11-30
1996-11-26
Ramsey, Kenneth J.
Metal fusion bonding
Solder form
428327, 428331, 428421, B23K 35368
Patent
active
055776558
ABSTRACT:
Flexible metal tapes and adhesives are disclosed. The tapes comprise one or more alloy powders, PTFE powder, and a water-based casting vehicle, while the adhesives include inorganic substances such as sodium silicate, boric acid, sodium tetraborate, sodium fluoride, or sodium aluminum fluoride as well as pastes having compositions similar to the flexible metal tapes. The tapes and adhesives shrink minimally linearly when brazed to metal substrates, avoiding surface cracks that often result from shrinkage. The adhesive additionally retains the tape in place on the substrate, regardless of orientation, both before and during brazing.
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Ramsey Kenneth J.
Russell Dean W.
The Morgan Crucible Company plc
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