Flexible MEMS thin film without manufactured substrate and...

Details Flexible MEMS thin film without manufactured substrate and... Flexible MEMS thin film without manufactured substrate and...

2005-11-28

2008-11-04

Pham, Hoai v (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S110000, C257SE21499

Reexamination Certificate

active

07445956

ABSTRACT:
A process for producing flexible MEMS thin film without a manufactured substrate applied in a MEMS manufacture specially includes a method of forming a component interface in the middle between a manufactured substrate and a MEMS thin film formed on the manufactured substrate as a basis, which component interface is so easily destroyed by an external force that the MEMS thin film produced by the mentioned process is easily separated from the manufactured substrate, and the separated MEMS thin film due to out of limitation from the manufactured substrate may be further processed in later working process to obtain a MEMS thin film with special structural features has flexibility and particularly has electrical circuits, micro structure, or MEMS components integrated and manufactured into inside or on its both sides.

REFERENCES:
patent: 6982184 (2006-01-01), Silverbrook

Affiliated with

Also associated with

Rating

Flexible MEMS thin film without manufactured substrate and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible MEMS thin film without manufactured substrate and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible MEMS thin film without manufactured substrate and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4029754