Flexible lead bonding apparatus

Details Flexible lead bonding apparatus Flexible lead bonding apparatus

1975-06-19

1977-09-27

Smith, Al Lawrence

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 57, 228180A, 226 62, 226117, H01L 2160

Patent

active

040506185

ABSTRACT:
An apparatus for bonding the flexible leads of a sprocketed lead frame tape to the terminals of an integrated circuit device is provided with a movable index station, movable bonding anvil means and a vertically moving bonding tool. The flexible leads on the lead frame tape are automatically positioned by the indexing station relative to the bonding tool with extreme final accuracy. The device to be bonded to the flexible leads may be manually or automatically positioned relative to said bonding tool to align the bonding tool, the flexible leads and the integrated circuit device terminals in axial bonding alignment.

REFERENCES:
patent: 1305002 (1919-05-01), Oiler
patent: 1444884 (1923-02-01), Pittman
patent: 1767846 (1930-06-01), Howell
patent: 2046572 (1936-07-01), Merta
patent: 2322501 (1943-06-01), Barnitz
patent: 3477630 (1969-11-01), Schneider
patent: 3586223 (1971-06-01), Betts
patent: 3771711 (1973-11-01), Lesyk et al.
patent: 3831252 (1974-08-01), Miller
patent: 3840163 (1974-10-01), Diepeveen
patent: 3900257 (1975-08-01), Woolley, Jr. et al.
patent: 3949925 (1976-04-01), Keizer et al.

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