Flexible laminate module including spacers embedded in an adhesi

Details Flexible laminate module including spacers embedded in an adhesi Flexible laminate module including spacers embedded in an adhesi

1996-06-21

1998-03-03

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257712, 257713, 257709, 361704, 361714, 361715, H05K 503, H05K 504, H05K 720, H01L 2334

Patent

active

057242305

ABSTRACT:
An electronic module is provided including a chip bonded to a flexible laminate, and an apparatus for establishing coplanarity of a surface of the module, the apparatus comprising (1) a stiffener having a recessed portion for receiving the chip mounted to the flexible laminate, the recessed portion including a first planar surface and a second planar surface with the two planar surfaces being substantially parallel to each other, and (2) an adhesive bond line along the second planar surface for attaching the flexible laminate to the stiffener, the adhesive bond line including a plurality of spacers embedded within the adhesive bond line.

REFERENCES:
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5404273 (1995-04-01), Akagawa
patent: 5409865 (1995-04-01), Karnezos
patent: 5625228 (1997-04-01), Rogren
"Has the Packaging Revolution Finally Run Out of Steam?," Iscoff, Ron, Semiconductor International, Feb. 1995, pp. 67-72.
"Shinko Electric Commits to `Skimpy` IC-Package Revolution," Semiconductor International, Sep. 1995, p. 17.
U.S. Patent Application Serial No. 08/507,719 filed Jul. 26, 1995 (EN9-93-051X).

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