Flexible interconnect film including resistor and capacitor laye

Details Flexible interconnect film including resistor and capacitor laye Flexible interconnect film including resistor and capacitor laye

1996-10-10

1999-02-23

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257532, 257700, 257359, 257379, 257528, 257774, 257760, 361313, H01L 23053, H01L 2302, H01L 2348

Patent

active

058747702

ABSTRACT:
A method for fabricating a flexible interconnect film includes applying a resistor layer over one or both surfaces of a dielectric film; applying a metallization layer over the resistor layer with the resistor layer including a material facilitating adhesion of the dielectric film and the metallization layer; applying a capacitor dielectric layer over the metallization layer; and applying a capacitor electrode layer over the capacitor dielectric layer. The capacitor electrode layer is patterned to form a first capacitor electrode; the capacitor dielectric layer is patterned; the metallization layer is patterned to form a resistor; and the metallization layer and the resistor layer are patterned to form an inductor and a second capacitor electrode. In one embodiment, the dielectric film includes a polyimide, the resistor layer includes tantalum nitride, and the capacitor dielectric layer includes amorphous hydrogenated carbon or tantalum oxide. If the resistor and metallization layers are applied over both surfaces of the dielectric film, passive components can be fabricated on both surfaces of the dielectric film. The dielectric film can have vias therein with the resistor and metallization layers extending through the vias. A circuit chip can be attached and coupled to the passive components by metallization patterned through vias in an additional dielectric layer.

REFERENCES:
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4897153 (1990-01-01), Cole et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 5108825 (1992-04-01), Wojnarowski et al.
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5338975 (1994-08-01), Cole, Jr. et al.
patent: 5353195 (1994-10-01), Fillion et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5370766 (1994-12-01), Desaigoudar et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5436062 (1995-07-01), Schmidt et al.
patent: 5450263 (1995-09-01), Desaigoudar et al.
patent: 5479316 (1995-12-01), Smrtic et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5530288 (1996-06-01), Stone
patent: 5548099 (1996-08-01), Cole, Jr. et al.
patent: 5559363 (1996-09-01), Immorlica, Jr.
patent: 5563762 (1996-10-01), Leung et al.
patent: 5583739 (1996-12-01), Vu et al.
patent: 5683928 (1997-11-01), Wojnarowski et al.
patent: 5684304 (1997-11-01), Smears
"Plasma Chemical Vapour Deposition of Iron-Containing Hydrogenated Carbon Films Using a Single-Source Processor" by Wrobel, et al, Journal of Chemical Vapor Deposition, vol. 1-Jul. 1992.
"The Handbook of Thin Film Technology" Maissel and Gland eds., McGraw-Hill Book Company, 1970, 1983 Reissue, Chapters 18 and 19.
U.S. Patent Application "Applications of Thin Film Electronic Components on Organic and Inorganic Surfaces" by Wojnarowski, et al, Ser. No. 08/349,278 filed Dec. 5, 1994.
U.S. Patent Application "Thin Film Resistors on Organic Surfaces", by Wojnarowski, et al, Ser. No. 08/349,228 filed Dec. 5, 1994.
US. Patent Application "Structure and Fabrication Method for Thin Film Capacitors" by Saia, et al, Ser. No. 08/566,616 filed Dec. 4, 1995.

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