Wave transmission lines and networks – Plural channel systems – With balanced circuits
Reexamination Certificate
2010-04-16
2011-10-25
Lee, Benny (Department: 2817)
Wave transmission lines and networks
Plural channel systems
With balanced circuits
C333S034000, C333S247000
Reexamination Certificate
active
08044746
ABSTRACT:
A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
REFERENCES:
patent: 2997521 (1961-08-01), Dahlgren
patent: 3579206 (1971-05-01), Grange
patent: 3772776 (1973-11-01), Weisenburger
patent: 4753005 (1988-06-01), Hasircoglu
patent: 4800461 (1989-01-01), Dixon et al.
patent: 5021866 (1991-06-01), Sudo et al.
patent: 5072074 (1991-12-01), DeMaso et al.
patent: 5083238 (1992-01-01), Bousman
patent: 5206712 (1993-04-01), Kornrumpf et al.
patent: 5264787 (1993-11-01), Woith et al.
patent: 5296651 (1994-03-01), Gurrie et al.
patent: 5345205 (1994-09-01), Kornrumpf
patent: 5349317 (1994-09-01), Notani et al.
patent: 5363275 (1994-11-01), Frankeny et al.
patent: 5373108 (1994-12-01), Ysbrand
patent: 5385478 (1995-01-01), Niekawa
patent: 5408053 (1995-04-01), Young
patent: 5500489 (1996-03-01), Shah et al.
patent: 5580272 (1996-12-01), Yamaguchi et al.
patent: 5597470 (1997-01-01), Karavakis et al.
patent: 5621333 (1997-04-01), Long et al.
patent: 5631446 (1997-05-01), Quan
patent: 5631466 (1997-05-01), Botti et al.
patent: 5632646 (1997-05-01), Ii et al.
patent: 5695360 (1997-12-01), Seto et al.
patent: 5742484 (1998-04-01), Gillette et al.
patent: 5904586 (1999-05-01), Takayasu
patent: 6007349 (1999-12-01), Distefano et al.
patent: 6027958 (2000-02-01), Vu et al.
patent: 6040524 (2000-03-01), Kobayashi et al.
patent: 6086386 (2000-07-01), Fjelstad et al.
patent: 6116947 (2000-09-01), Takayasu
patent: 6124637 (2000-09-01), Freyman et al.
patent: 6186811 (2001-02-01), Tojo et al.
patent: 6281451 (2001-08-01), Chan et al.
patent: 6300802 (2001-10-01), Smetana
patent: 6383017 (2002-05-01), Takayasu
patent: 6383401 (2002-05-01), Labzentis et al.
patent: 6386905 (2002-05-01), Ito
patent: 6515233 (2003-02-01), Labzentis et al.
patent: 6522173 (2003-02-01), Otsuka
patent: 6559389 (2003-05-01), Kornrumpf et al.
patent: 6590466 (2003-07-01), Lin et al.
patent: 6677832 (2004-01-01), Guinn et al.
patent: 6797891 (2004-09-01), Blair et al.
patent: 6809608 (2004-10-01), Fjelstad
patent: 6867668 (2005-03-01), Dagostino et al.
patent: 6884108 (2005-04-01), Saito et al.
patent: 6932648 (2005-08-01), Chiu et al.
patent: 7021969 (2006-04-01), Matsunaga
patent: 7121874 (2006-10-01), Jeon
patent: 7145411 (2006-12-01), Blair et al.
patent: 7212088 (2007-05-01), Norregaard
patent: 7298754 (2007-11-01), Miller et al.
patent: 7336139 (2008-02-01), Blair et al.
patent: 7719378 (2010-05-01), Blair et al.
patent: 2002/0197906 (2002-12-01), Fuerst et al.
patent: 2003/0034854 (2003-02-01), Tzeng
patent: 2003/0180011 (2003-09-01), Aronson
patent: WO9940627 (1999-08-01), None
Buck, T.J., High Density Flex-rigid Circuits—A Solution for Board-to-board Transmission Line Interconnects, Circuit World, vol. 19, No. 4 (1993), pp. 21-27.
Burkard, Hans, et al., An ultra-thin, highly flexible Multilayer (2007).
Fjelstad, Joseph, “An Engineer's Guide to Flexible Circuit Technology”, Chapter 4, pp. 52-97, Electrochemical Publications Ltd., 1997.
Fjelstad, Joseph, “Flexible Circuit Technology”, 2nd Edition, Aug. 1998, Chapters 5-6, pp. 73-152, Silicon Valley Publishers Group, Sunnyvale, CA.
Fjelstad, Joseph, Flexible circuitry-technology background and important fundamental issues, Circuit World 25/2, 1999, pp. 6-10.
Handbook of Flexible Circuits, Edited by Ken Gilleo, Kluwer Academic Publishers Group, 2001 (original publication 1992), Chapters 3-6, pp. 42-122.
Introduction to Common Printed Circuit Transmission Lines, Jun. 2, 2003, AN2093, Maxim Integrated Products.
National Semiconductor, LVDS Owner's Manual, A General Design Guide for National's Low Voltage Differential Signaling (LVDS) and Bus LVDS Products, 2nd Edition, Revision 2.0- Spring 2000, p. 47.
Pham, A. et al. Development of Vertical Interconnects for Mixed Substrate Technology, IEEE 54th ARFTG Conference Digest, Atlanta GA, Dec. 1999, pp. 132-136.
Rapala, T., et al., New Materials and Build-up Constructions for Advanced Rigid-Flex PCB Applications (Jun. 1, 2005), EIPC Winter Conference, Barcelona.
Yamanaka, N. et al., “320 Gb/s High-Speed ATM Switching System Hardware Technologies Based on Copper-Polyimide MCM”, IEEE Trans. on Components, Packaging and Manufacturing Technology, Part B, vol. 18, No. 1, Feb. 1995, pp. 83- 91.
Blair James Leroy
Schreiber Oswin M.
Smith Jeffrey Thomas
Ho Eric
Lee Benny
QUALCOMM Incorporated
Xu Jiayu
LandOfFree
Flexible interconnect cable with first and second signal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible interconnect cable with first and second signal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible interconnect cable with first and second signal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4273530