Flexible integrated circuit package

Details Flexible integrated circuit package Flexible integrated circuit package

1997-12-02

1999-05-04

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174 524, 174260, 257707, 257713, 257719, 257738, 257723, 361720, 361760, 361772, 361773, H05K 720, H05K 100

Patent

active

059010410

ABSTRACT:
A flexible integrated circuit package for mounting on a substrate is disclosed. The package consists of a tape film having layers of dielectric and conductive material, a semiconductor die and an array of conductive leads. A molded body covers the die, and absorbs the majority of the pressure applied when compressing the package between a heatsink and a printed circuit board (PCB). Rigid removable support material surrounds the molded body to keep the package flat while it is being mounted to the PCB. The support material is removed after soldering of the package to the PCB. The invention permits the package to be tightly compressed between a heatsink and a substrate without causing degradation of the conductive connections. Reliability of the connections is further increased since the tape film is flexible enough to accommodate bending of the substrate to which the package is connected.

REFERENCES:
patent: 4771330 (1988-09-01), Long
patent: 5045921 (1991-09-01), Lin et al.
patent: 5222014 (1993-06-01), Lin
patent: 5239198 (1993-08-01), Lin et al.
patent: 5477082 (1995-12-01), Bucky, III et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5834848 (1998-11-01), Iwasaki
Dr. F.E. Andros, Dr. R.B. Hammer; "Area Array Tab Package Technology"; presented by IBM, pp. 1 to 8 No Known Date.

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